1、 科研项目： 1. 基于微服务架构和数据驱动的5G应急救治平台研发，2021-2023年 2. 不完备数据下光伏电池缺陷识别的跨域迁移学习方法研究，2021-2024年 3. 基于5G的智慧急救医疗系统研发，2020-2023年 4. 一种基于通信信道的无源超高频 RFID 标签芯片安全机制研究，2013年 5. 汽车数字化标准信源系统世博会区域应用研究与示范，2009-2011年
2、 论文、专著：近期代表作，限10篇（部） 1. J.Mao, J.Xiao Jiang Xiao,Y. Guo and X. Chen, "A Shaped Beam Antenna Method Based on Electromagnetic Band Gap Structure," 2020 IEEE MTT-S International Conference on Numerical Electromagnetic and Multiphysics Modeling and Optimization(NEMO), 2020, pp. 1-4, doi: 10.1109/NEMO49486.2020.9343646. 2. Y. Guo, K. Hong, W. Xu, F. Li, X. Liang, J. Mao, X. Chen, "Simulation and Analysis of the Influence of External Cables on the Electromagnetic Radiation of the Electronic Equipment," 2020 IEEE MTT-S International Conference on Numerical Electromagnetic and Multiphysics Modeling and Optimization(NEMO), 2020, pp. 1-4, doi: 10.1109/NEMO49486.2020.9343478. 3. K. Liu, X. Wen, M. Huang, X. Yang, J. Mao. Solar cell defect enhancement method based on generative adversarial network. Journal of ZheJiang University (Engineering Science), 2020, 54(4): 684-693. 4. K. Shao, H. Li, J. Mao and Z. Wang. “Design and FPGA implementation of RFID Tag encryption algorithm”, Computer Engineering, Oct. 2012. 5. C. Wang, J. Mao, G. Selli, S. Luan, L. Zhang, J. Fan, D. J. Pommerenke, R. E. DuBroff, and J. L. Drewniak. “An efficient approach for power delivery network design with closed-form expressions of parasitic inductances”, IEEE Trans.Advanced Packaging, May 2006. 6. J.Mao, and N. Karim, “Improving Electromagnetic Compatibility Performance of Packages and SiP Modules Using a Conformal Shielding Solution”, IEEE Asia-Pacific Microwave Conference 2010. 7. J.Mao, and N. Karim, “IPD RF library on Silicon substrate using thick Copper and multilayer RDL technology”, 3D/SiP Advanced Packaging Symposium 2008. 8. B. Bagdasarian, J. Blonski, J. Mao, and N. Karim, “RF Sip Design and Integration”, IEEE Asia-Pacific Microwave Conference 2005, Suzhou, P. R. China. 9. J.Mao, C. Wang, L. Zhang, R. E. DuBroff, and J.L.Drewniak, “An efficient analysis method for the power bus impedance”, EMC Europe 2004, Eindhoven, Netherlands. 10. J.Mao, G. Antonini, A.Orlandi, and J.L.Drewniak ,“Efficient capacitance calculations for PEEC circuit analysis”, PIERS’2004, Pisa, Italy. 11. J.Mao, G. Antonini, A.Orlandi, and J.L.Drewniak, “Extraction of SPICE-type equivalent circuits of signal via transitions using the PEEC method”, IEEE Int. Symp. on Electromagnetic Compatibility, Santa Clara, CA, Aug. 2004. 3、其他成果（奖励、专利等）： 1. 基于非线性拟合的风力偏航状态智能自适应控制方法，中国专利申请号：CN201610714561.7 2. 用于微电子机械系统麦克风的电磁屏蔽技术 （System and method to provide RF shielding for MEMS microphone package），US Patent No. 7915715 3. 芯片封装中的电磁屏蔽 （Shielding for a semiconductor package）, US Patent No. 8129824 |
